Aštrus kraštas lazeris diodas radiatoriai
Aukšta kokybė radiatoriai su super aštriais kraštais for the mounting of high power laser diodes. Typical outline is C mounts.
Medžiagų
radiatorius kūnai yra paprastai pagamintas iš vakuumas infiltruotas 90/10 W/Cu, kuris turi žemas terminis išplėtimas (CTE 20-300 degree =6%4 x 10-6 ppm/K) ir aukštas terminis laidumas (TC=185%W/mK). C mounts paprastai turi a W/Cu insert brazed to a Cu body. To ensure the best performance for producing sharp edges and užtikrinant patikima coatings it is imperative kad the raw W/Cu material is labai homogeniškas. Vakuumas infiltruotas W/Cu is normaliai esminis, as it daro ne paprastai kenčia nuo the problems of aglomeracijos of un-sintered W powder, which can prove problemic with powder metrology (press) type materials.
Aštrūs briaunos
To allow the laser die to be mounted right up to the edge of the heatsink requires edge of the highest possible quality. This need very good quality material and also high quality machining. Edges are suplinped with <5 micron radius and with <5 micron long chip outs.
Danga
Tai yra svarbu taikyti dengti dangas kad do ne kompromisas the sharp edge and smooth flat surfaces that have been carefully created, but that also properly encase the heatsink material and provide good wetting and solder barriers. The metalurgija of W/Cu can lead to problems with traditional electroputd coatings and taigi LEW supply high quality vacuum sputtered coatings. Typly coatings on the heatsink are Ti/Ni/Pt/Au.
Iš anksto įnešta AuSn
Maksimalus lazeris našumas reikalauja aukšta kokybė jungtys tarp the laser die and heatsink. Teisingai taikoma pre-deposited AuSn solder layers ensure minimal voiding and sotis minimise terminis varža tarp lazeris die ir radiatorius. To užtikrinti the best reflow and wetting the ratio of Au to Sn is adjusted to account for both the Au in the heatsink coating and on the bottomside of the laser die. Typical pre-deposited solder ratio is 76 Au/24 Sn, pasirinktinai deponuotas at 3.5 – 5.5 mikronai storas. The AuSn layer is typly covered with a thin Au coating to protect the solder from oxidising and maximise shelf life. The solder layer can also be wrapped over the critical edge to aid solder wetting and minimise solder balling in front of the laser facet.
Standoff keramika/tagai
Metalizuota standoff keramika are atkabinta to the heatsink using AuGe solder (before pre-deposited AuSn is applied). The strength of the metallisation to the ceramic and the AuGe solder is critical in užtikrinimas patikimumas of the heatsink assembly. This is ypa important where plated copper tags are attached to the standoff. Typical metallised standoffs 2 mm² have shear strengths greater than 20.0 kg (5kg/mm²). Tipiškas varis žymės (2 mm pločio) turi lupa stipriosios pusės in perteklius 1,5 kg.
Standartinis/bespoke kontūrai
A pasirinkimas of standard outlines are available tinka for įvairiems lazeriams die lengths. It is also possible to modify standard outlines or manufacture bespoke designs as required.
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